Over
the past twenty years, the electric, electronic, and semi-conductor industries
of the world have grown to unimaginable Ievels and will continue to reach
greater heights at even greater speeds. These industries, especially for
silicon wafer fabrication, demands high precision diamond tools to meet
the extremely high level of accuracy and mirror finishing required to manufacture
their respective products.DIPROTEX has engineered state-of-the-art diamond tools of extremely high precision such as micro-multi-blades, special wafer surface or back grinding wheels, wafer edge grinding wheels, and wafer dicing blades of various sizes.
DIPROTEX assures our global customers that we are using the most-advanced equipments and facilities to manufacture and supply high precision diamond tools, and we will continue to make further strides to meet all future needs and applications.
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